• Spray Volume: 3 pL ~ 500 p
• Maximum Jetting Frequency: 20kHz
• X-Y-Z Repeat Positioning Accuracy: ±5μm / ±5μm / ±20μm
• Viscosity Range: 0.1 ~ 100 mPa·s
• S-IJP Precision Jetting Technology, Non-contact Ultra-micro Dispensing
• Supports Up to 4 Printheads, Closed-loop Control for Ultra-high Consistency
• PC+PLC Control System, CCD Camera Automatic Calibration
Technical Principle：Underfill Dispensing Process precisely controls the adhesive volume and dispensing path to form reliable protection between the chip and the substrate.
Application Scenarios：Chip Scale Package (CSP) / Ball Grid Array (BGA) / System in Package (SiP) / Wafer Level Packaging (WLP) / Flip Chip / 2.5D & 3D Packaging.
